"Deposition of Uniform Zr-Sn-Ti-O Films by On-Axis Reactive Sputtering" by Robert B. Van Dover and Lynn Schneemeyer
 

Deposition of Uniform Zr-Sn-Ti-O Films by On-Axis Reactive Sputtering

Document Type

Article

Publication Date

9-1-1998

Journal / Book Title

IEEE Electron Device Letters

Abstract

We describe the deposition of amorphous Zr-Sn-Ti-O (aZTT) dielectric thin films using conventional on-axis reactive sputtering. Thin films of composition Zr 0.2Sn 0.2Ti 0.6O 2 have excellent dielectric properties: 40-50-nm thick films with a dielectric constant of 50-70 were obtained, depending on the processing conditions, yielding a specific capacitance of 9-17 fF/μm 2. Breakdown fields were measured to be 3-5 MV/cm, yielding a figure of merit εε 0E br = 15-30 μC/cm 2, up to eightfold higher than conventional deposited SiO 2. Leakage currents, measured at 1.0 MV/cm, were in the range 10 -9-10 -7 A/cm 2. This material appears well-suited for use in Si-IC device technology, for example as storage capacitors in DRAM.

DOI

10.1109/55.709630

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